US 11,939,498 B2
Water borne dry lamination bonding agent with heat resistance improvement
Mai Chen, Chicago, IL (US); Yuanjia Pan, Shanghai (CN); Xinhong Wang, Shanghai (CN); Gaobing Chen, Shanghai (CN); and Xinchun Liu, Shanghai (CN)
Assigned to Dow Global Technologies LLC, Midland, MI (US); and Rohm and Haas Company, Philadelphia, PA (US)
Appl. No. 16/604,368
Filed by DOW GLOBAL TECHNOLOGIES LLC, Midland, MI (US); and ROHM AND HAAS COMPANY, Philadelphia, PA (US)
PCT Filed Apr. 11, 2017, PCT No. PCT/CN2017/080065
§ 371(c)(1), (2) Date Oct. 10, 2019,
PCT Pub. No. WO2018/187935, PCT Pub. Date Oct. 18, 2018.
Prior Publication US 2020/0123425 A1, Apr. 23, 2020
Int. Cl. C09J 193/04 (2006.01); B32B 7/12 (2006.01); C09J 5/00 (2006.01); C09J 133/06 (2006.01)
CPC C09J 193/04 (2013.01) [B32B 7/12 (2013.01); C09J 5/00 (2013.01); C09J 133/062 (2013.01); C09J 2433/00 (2013.01); C09J 2475/00 (2013.01); C09J 2493/00 (2013.01)] 19 Claims
 
1. A laminate comprising:
a first substrate that is a biaxially oriented polypropylene (BOPP) film;
a second substrate that is a vacuum metallized casted polyethylene terephthalate polyester film (VMPET);
a third substrate that is a polyethylene (PE) film;
a composition consisting of
(a) a first component that is an aqueous mixture with its solid portion consisting of
(i) 0.1% to 10% of a polyol containing at least two hydroxyl groups and being selected from the group consisting of water dispersible polyether polyols, polyester polyols, polyether polyester polyols and mixtures thereof,
(ii) 3% to 30% of a rosin resin, and
(iii) from 65% to 96% of a polymer having from 23-45% residues of at least one styrene monomer, from 50-80% residues of at least one acrylic monomer having a Tg less than 0° C., and from 1.5% to 2.5% residues of (meth)acrylic acid; and
(b) a second component consisting of a water dispersible polyisocyanate, wherein the second component is present relative to the first component at a NCO/NCO-reactive group molar ratio of 1:1 to 8:1; wherein the composition bonds the first substrate to the second substrate; and
the composition bonds the second substrate to the third substrate.