US 11,939,497 B2
Silicone-based adhesive sheet, multilayer structure including same, and method for producing semiconductor device
Nohno Toda, Ichihara (JP); and Manabu Sutoh, Ichihara (JP)
Assigned to DOW TORAY CO., LTD., Tokyo (JP)
Appl. No. 16/955,209
Filed by DOW TORAY CO., LTD., Tokyo (JP)
PCT Filed Dec. 19, 2018, PCT No. PCT/JP2018/046702
§ 371(c)(1), (2) Date Jun. 18, 2020,
PCT Pub. No. WO2019/124417, PCT Pub. Date Jun. 27, 2019.
Claims priority of application No. 2017-243335 (JP), filed on Dec. 20, 2017.
Prior Publication US 2020/0339848 A1, Oct. 29, 2020
Int. Cl. C09J 183/04 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C09J 7/35 (2018.01); C09J 11/06 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01)
CPC C09J 183/04 (2013.01) [B32B 27/08 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C09J 7/35 (2018.01); C09J 11/06 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); B32B 2457/14 (2013.01); C09J 2203/326 (2013.01); C09J 2483/00 (2013.01); H01L 2221/68327 (2013.01)] 18 Claims
 
1. A silicone-based adhesive sheet, wherein the silicone-based adhesive sheet is a cross-linked material of a cross-linkable silicone composition comprising:
(A) an organopolysiloxane that includes at least two silicon atom-bonded alkenyl groups in a single molecule;
(B) an organopolysiloxane that includes at least two silicon-bonded hydrogen atoms in a single molecule;
(C) at least one adhesion promoting agent; and
(D) a hydrosilylation reaction catalyst; and
wherein prior to cure of the cross-linkable silicone composition, the organopolysiloxane (A) has an initial content of low molecular weight oligomers selected from the group consisting of octamethyl tetrasiloxane (D4) and decamethyl pentasiloxane (D5), and wherein the initial content is subsequently reduced in, or eliminated from, the cross-linked material; and
wherein the silicone-based adhesive sheet is subjected to a texture analyzer to lower a stainless steel probe with a diameter of 8 mm at a rate of 0.01 mm/s in respect to any surface of the silicone-based adhesive sheet, to apply a load of 50 gf, followed by raising the probe at a rate of 0.5 mm/s after holding the load for 0.5 seconds, such that the silicone-based adhesive sheet undergoes interfacial delamination from the probe, and the adhesive strength exhibits a maximum value produced during measurement of the stress applied to the probe when raising; and further wherein the surface that exhibited the maximum value for the adhesive strength is further heated for three hours in a range of between 100 and 200° C., wherein the delamination mode of the adhesive surface from another non-adhesive substrate changes to cohesive fracturing, and exhibits permanent adhesion with a maximum value of adhesive strength of no less than 10 gf.