US 11,939,494 B2
Resin composition for bonding semiconductor and adhesive film for semiconductor using the same
Jong Min Jang, Daejeon (KR); Byoung Ju Choi, Daejeon (KR); Kwang Joo Lee, Daejeon (KR); and Yu Lin Sun, Daejeon (KR)
Assigned to LG CHEM, LTD., Seoul (KR)
Filed by LG CHEM, LTD., Seoul (KR)
Filed on Aug. 17, 2021, as Appl. No. 17/404,053.
Claims priority of application No. 10-2020-0104211 (KR), filed on Aug. 19, 2020.
Prior Publication US 2022/0098455 A1, Mar. 31, 2022
Int. Cl. C09J 163/00 (2006.01); C09J 133/08 (2006.01)
CPC C09J 163/00 (2013.01) [C09J 133/08 (2013.01)] 12 Claims
 
1. An adhesive resin composition for a semiconductor containing:
a binder resin comprising at least one resin selected from the group consisting of a (meth)acrylate-based resin and an epoxy resin;
a curing agent; and
at least two inorganic fillers having different average particle diameters,
wherein the inorganic fillers comprise a first inorganic filler having an average particle diameter of 3 μm or more and less than 10 μm, and a second inorganic filler having an average particle diameter of greater than 0.1 μm and less than 1.0 μm,
wherein the first inorganic filler has a specific surface area of 2.0 m2/g to 4.0 m2/g, and
wherein the second inorganic filler has a specific surface area of 7.5 m2/g to 14.0 m2/g.