US 11,939,484 B2
Three-dimensional printing
Graciela E. Negri Jimenez, San Diego, CA (US); Michael A. Novick, San Diego, CA (US); Tienteh Chen, San Diego, CA (US); and Jacob Wright, San Diego, CA (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 17/298,927
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Jun. 10, 2019, PCT No. PCT/US2019/036297
§ 371(c)(1), (2) Date Jun. 1, 2021,
PCT Pub. No. WO2020/251528, PCT Pub. Date Dec. 17, 2020.
Prior Publication US 2022/0112393 A1, Apr. 14, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C09D 11/54 (2014.01); B29C 64/165 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C08K 5/5415 (2006.01); C09D 11/102 (2014.01); B29K 83/00 (2006.01)
CPC C09D 11/54 (2013.01) [B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C08K 5/5415 (2013.01); C09D 11/102 (2013.01); B29K 2083/00 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A multi-fluid kit for three-dimensional printing, comprising:
a fusing agent comprising water and a radiation absorber, wherein the radiation absorber absorbs radiation energy and converts the radiation energy to heat; and
a detailing agent comprising water and from about 0.1 wt % to about 20 wt % of organosilanes based on a total weight of the detailing agent, wherein the organosilanes include an organosilane compound with a central silicon having both a water-solubilizing group and multiple hydrolyzable groups attached to the central silicon.