US 11,939,472 B2
Curable silicone composition, encapsulant and optical semiconductor device
Yutaka Oka, Chiba (JP)
Assigned to Dupont Toray Specialty Materials Kabushiki Kaisha, Tokyo (JP)
Filed by DuPont Toray Specialty Materials Kabushiki Kaisha, Tokyo (JP)
Filed on May 16, 2022, as Appl. No. 17/663,604.
Claims priority of application No. 2021-084621 (JP), filed on May 19, 2021.
Prior Publication US 2022/0372291 A1, Nov. 24, 2022
Int. Cl. C08L 83/04 (2006.01)
CPC C08L 83/04 (2013.01) [C08L 2203/20 (2013.01); C08L 2205/025 (2013.01)] 18 Claims
 
1. A curable silicone composition comprising:
(A) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one siloxane unit represented by SiO4/2 wherein the component (A) is represented by the following average unit formula(I);
(R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d(XO1/2)e   (I)
wherein
R1 may be the same or different and each is independently selected from the group consisting of C1-12 alkyl groups and C2-12 alkenyl groups, where at least two R1 in one molecule are alkenyl groups, 0<a<1, 0<b<1, 0<c<0.9, 0<d<1, 0<e<0.4, and a+b+c+d=1.0; and
X is a hydrogen atom or an alkyl group;
(B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in one molecule wherein the organohydrogenpolysiloxane is a linear organohydrogenpolysiloxane having silicon atom-bonded hydrogen atoms on a side chain;
(C) an alkyne group-containing compound that is an alkyne group-containing silane selected from the group consisting of methyl-tris(1,1-dimethyl-2-butynoxy)silane, methyl-tris(3-methyl-1-butyn-3-oxy)silane, vinyl-tris (1,1-dimethyl-2-butynoxy)silane, and combinations thereof; and
(D) a curing catalyst, wherein the content of the resinous alkenyl group-containing organopolysiloxane (A) is 20 mass % or more based on the total mass of the organopolysiloxanes.