	US 11,939,450 B2
	Resin composition for circuit board, molded body for circuit board, layered body for circuit board, and circuit board
Hirofumi Mukae, Osaka (JP); Hirokazu Komori, Osaka (JP); Masaji Komori, Osaka (JP); Hideki Kono, Osaka (JP); and Ayane Nakaue, Osaka (JP)
Assigned to DAIKIN INDUSTRIES, LTD., Osaka (JP)
Filed by DAIKIN INDUSTRIES, LTD., Osaka (JP)
Filed on Jan. 14, 2022, as Appl. No. 17/575,695.
Application 17/575,695 is a continuation of application No. PCT/JP2020/027035, filed on Jul. 10, 2020.
Claims priority of application No. 2019-131261 (JP), filed on Jul. 16, 2019.
Prior Publication US 2022/0135767 A1, May 5, 2022
Int. Cl. C08K 3/38 (2006.01); B32B 15/082 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); C08F 214/26 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01)

CPC C08K 3/38 (2013.01) [B32B 15/082 (2013.01); B32B 27/20 (2013.01); B32B 27/304 (2013.01); C08F 214/262 (2013.01); C08F 214/265 (2013.01); H05K 1/0373 (2013.01); B32B 2250/02 (2013.01); B32B 2264/10 (2013.01); B32B 2307/302 (2013.01); B32B 2457/08 (2013.01); C08K 2003/385 (2013.01); C08K 2201/005 (2013.01); H05K 1/0237 (2013.01)]

10 Claims

1. A resin composition for a circuit board, comprising a melt-fabricable fluororesin and a particulate boron nitride, wherein the particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 μm and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 μm, and

wherein a proportion of particles having a particle size of 35.0 μm or greater is 0.1% or less.