	US 11,939,447 B2
	Thermosetting composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
Yoshihiro Nakazumi, Tokyo (JP); and Kentaro Takano, Tokyo (JP)
Assigned to Mitsubishi Gas Chemical Company, Inc., Tokyo (JP)
Appl. No. 17/050,449
Filed by MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo (JP)
PCT Filed Apr. 2, 2019, PCT No. PCT/JP2019/014704 § 371(c)(1), (2) Date Oct. 25, 2020, PCT Pub. No. WO2019/208129, PCT Pub. Date Oct. 31, 2019.
Claims priority of application No. 2018-086681 (JP), filed on Apr. 27, 2018.
Prior Publication US 2021/0238381 A1, Aug. 5, 2021
Int. Cl. H05K 1/03 (2006.01); C08J 5/24 (2006.01); C08K 3/01 (2018.01); C08K 3/013 (2018.01); C08K 3/38 (2006.01)

CPC C08K 3/013 (2018.01) [C08J 5/244 (2021.05); C08J 5/249 (2021.05); C08K 3/38 (2013.01); H05K 1/0366 (2013.01); C08K 2003/385 (2013.01); H05K 2201/0209 (2013.01)]

14 Claims

1. A thermosetting composition comprising:

a thermosetting compound; and

a hexagonal boron nitride D,

wherein the thermosetting compound contains a cyanate compound A and/or a maleimide compound B, and a modified polyphenylene ether C having a substituent with a carbon-carbon unsaturated double bond at at least one terminal, and

a content of the hexagonal boron nitride D is 0.1 parts by mass or more and 25 parts by mass or less based on 100 parts by mass of the thermosetting compound.