US 11,938,722 B2
Integrated circuits including memory cells
Scott A. Linn, Corvallis, OR (US); James Michael Gardner, Corvallis, OR (US); and Michael W. Cumbie, Corvallis, OR (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed by HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, TX (US)
Filed on Sep. 10, 2021, as Appl. No. 17/471,844.
Application 17/471,844 is a continuation of application No. 16/956,316, granted, now 11,141,973, previously published as PCT/US2019/016732, filed on Feb. 6, 2019.
Prior Publication US 2022/0032612 A1, Feb. 3, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B41J 2/045 (2006.01)
CPC B41J 2/04536 (2013.01) [B41J 2/04586 (2013.01); B41J 2/04541 (2013.01)] 20 Claims
OG exemplary drawing
 
16. A fluid ejection device comprising:
an elongate substrate having a length, a thickness, and a width, wherein on the elongate substrate there is provided:
a plurality of nozzles arranged in a column along the length of the elongate substrate;
a plurality of memory cells arranged adjacent to the plurality of nozzles, each memory cell corresponding to a nozzle;
a configuration register storing data to enable or disable access to the plurality of memory cells;
an address decoder to select nozzles and memory cells corresponding to the selected nozzles in response to an address; and
fluid actuation logic to either eject fluid from the selected nozzles or access memory cells corresponding to the selected nozzles based on the data stored in the configuration register.