	US 11,938,688 B2
	Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate
Noriaki Murakami, Tokyo (JP); Ryoichi Uchimura, Tokyo (JP); Masahisa Ose, Tokyo (JP); and Kenichi Ohhashi, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 17/414,136
Filed by Showa Denko Materials Co., Ltd., Tokyo (JP)
PCT Filed Dec. 18, 2019, PCT No. PCT/JP2019/049508 § 371(c)(1), (2) Date Jun. 15, 2021, PCT Pub. No. WO2020/130007, PCT Pub. Date Jun. 25, 2020.
Claims priority of application No. 2018-236629 (JP), filed on Dec. 18, 2018.
Prior Publication US 2022/0080702 A1, Mar. 17, 2022
Int. Cl. B29C 70/16 (2006.01); B29C 70/00 (2006.01); B29C 70/22 (2006.01); B29C 70/30 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 7/02 (2019.01); B32B 7/022 (2019.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 17/04 (2006.01); H05K 1/03 (2006.01); B29K 101/10 (2006.01); B29K 309/08 (2006.01); B29L 9/00 (2006.01)

CPC B29C 70/16 (2013.01) [B29C 70/003 (2021.05); B29C 70/30 (2013.01); B32B 5/024 (2013.01); B32B 5/263 (2021.05); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 17/04 (2013.01); H05K 1/036 (2013.01); B29K 2101/10 (2013.01); B29K 2309/08 (2013.01); B29L 2009/00 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/54 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); H05K 2201/029 (2013.01)]

10 Claims

1. A laminate comprising two or more layers of a composite layer including a fiber substrate and a cured product of a thermosetting resin composition,

the two or more layers of the composite layer including one or more layer of a composite layer (X) and one or more layer of a composite layer (Y),

the composite layer (X) being a layer including a first fiber substrate constituted by first glass fibers,

the composite layer (Y) being a layer including a second fiber substrate constituted by second glass fibers, and

the second glass fibers having a higher tensile elastic modulus at 25° C. than the first glass fibers.