US 11,938,554 B2
Electroplating of niobium titanium
Danielle DeGraw, Pleasant Valley, NY (US); Yat-Kiu-Kent Fung, Woodside, NY (US); and James Robert Rozen, Peekskill, NY (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Jun. 9, 2021, as Appl. No. 17/342,805.
Application 17/342,805 is a continuation of application No. 16/170,760, filed on Oct. 25, 2018, granted, now 11,075,435.
Prior Publication US 2021/0296749 A1, Sep. 23, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01P 3/06 (2006.01); B23K 1/00 (2006.01); C25D 3/12 (2006.01); C25D 3/38 (2006.01); C25D 5/12 (2006.01); C25D 5/34 (2006.01); C25D 5/38 (2006.01); C25D 7/06 (2006.01); H01B 11/18 (2006.01); H01B 12/00 (2006.01); H01P 11/00 (2006.01); B23K 101/38 (2006.01); H01B 13/016 (2006.01)
CPC B23K 1/0016 (2013.01) [B23K 1/0008 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 5/12 (2013.01); C25D 5/34 (2013.01); C25D 5/38 (2013.01); C25D 7/0607 (2013.01); H01B 11/1817 (2013.01); H01B 12/00 (2013.01); H01P 3/06 (2013.01); H01P 11/005 (2013.01); B23K 2101/38 (2018.08); H01B 13/016 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A structure, comprising:
a niobium titanium substrate;
a metal layer plated on a portion of the niobium titanium substrate;
a coaxial connector attached to the metal layer;
a qubit attached to the coaxial connector; and
an amplifier attached to another portion of the niobium titanium substrate.