	US 11,938,543 B2
	Silver sintering preparation and the use thereof for the connecting of electronic components
Ly M. Chew, Bruchkobel (DE); Gregory Berube, Nashua, NH (US); and Seigi Suh, Chesterbrook, PA (US)
Assigned to HERAEUS DEUTSCHLAND GMBH & CO. KG, Hanau (DE)
Filed by Heraeus Deutschland Gmbh & Co. KG, Hanau (DE)
Filed on Apr. 9, 2021, as Appl. No. 17/301,642.
Prior Publication US 2022/0324021 A1, Oct. 13, 2022
Int. Cl. B22F 7/06 (2006.01); B22F 1/16 (2022.01); B22F 7/04 (2006.01); H01L 23/00 (2006.01); H01R 4/58 (2006.01)

CPC B22F 7/064 (2013.01) [B22F 1/16 (2022.01); B22F 7/04 (2013.01); H01L 24/29 (2013.01); H01R 4/58 (2013.01); B22F 2301/255 (2013.01); H01L 2224/05639 (2013.01)]

18 Claims

1. A silver sintering preparation, the preparation in the form of

a silver sintering paste comprising 70 to 95 wt.-% of coated silver particles (A) and 5 to 30 wt.-% of organic solvent (B), or

a silver sintering preform comprising 74.5 to 100 wt.-% of coated silver particles (A) and 0 to 0.5 wt.-% of organic solvent (B),

wherein the coating of the coated silver particles (A) comprises silver acetylacetonate (silver 2,4-pentanedionate) and,

wherein the coated silver particles (A) have a mean particle diameter (d₅₀) ranging from 0.2 to 20 μm.