US 11,938,500 B2
Substrate processing apparatus and method for determining deterioration degree of conductive pipe
Tadashi Iino, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Feb. 24, 2021, as Appl. No. 17/183,816.
Claims priority of application No. 2020-040244 (JP), filed on Mar. 9, 2020.
Prior Publication US 2021/0276031 A1, Sep. 9, 2021
Int. Cl. B05B 15/18 (2018.01); G01N 27/07 (2006.01)
CPC B05B 15/18 (2018.02) [G01N 27/07 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a substrate holder configured to hold and process a substrate;
a nozzle configured to eject a processing liquid to the substrate held by the substrate holder;
a conductive pipe connected to the nozzle and configured to supply the processing liquid to the nozzle;
a ground line that connects the conductive pipe and a reference potential;
a liquid receiver provided around the substrate holder and configured to receive the processing liquid ejected from the nozzle; and
a deterioration degree measuring unit configured to measure a deterioration degree of conductivity of the conductive pipe,
wherein the deterioration degree measuring unit includes:
a measurement liquid supply configured to supply a measurement liquid to the conductive pipe and eject the measurement liquid from the nozzle;
a potential difference generator configured to impart a potential difference between a liquid contact surface of the liquid receiver and the reference potential; and
an ammeter configured to, when the measurement liquid is ejected from the nozzle to the liquid receiver, measure a current value of a current flowing through a charge moving path established via the measurement liquid between the liquid contact surface of the liquid receiver and the ground line.
 
11. A method for determining a deterioration degree of conductivity of a conductive pipe in a substrate processing apparatus including:
a substrate holder configured to hold and process a substrate;
a nozzle configured to eject a processing liquid to the substrate held by the substrate holder;
the conductive pipe connected to the nozzle and configured to supply the processing liquid to the nozzle;
a ground line that connects the conductive pipe and a reference potential; and
a liquid receiver provided around the substrate holder and configured to receive the processing liquid ejected from the nozzle,
the method comprising:
imparting a potential difference between a liquid contact surface of the liquid receiver and the reference potential;
supplying a measurement liquid to the conductive pipe thereby ejecting the measurement liquid from the nozzle to the liquid receiver; and
when the measurement liquid is ejected from the nozzle to the liquid receiver, measuring a current value of a current flowing through a charge moving path established via the measurement liquid between the liquid contact surface of the liquid receiver and the ground line.