CPC B05B 1/3402 (2018.08) [B05B 3/006 (2013.01); B05B 12/08 (2013.01); B05B 12/124 (2013.01); B05B 13/0405 (2013.01); B05B 13/0442 (2013.01); B05B 14/40 (2018.02); B05B 16/60 (2018.02); H01L 21/67051 (2013.01); H01L 21/6715 (2013.01); H01L 21/67253 (2013.01); H01L 21/67259 (2013.01); H01L 21/68 (2013.01)] | 17 Claims |
1. A substrate processing apparatus comprising:
a support module that supports a substrate and is swingable;
a swing nozzle that is arranged on one side of the support module, moves in a swing manner, and sprays a chemical solution to the substrate;
a sensor arranged on one side of the swing nozzle to sense movement of the swing nozzle;
an electromagnet and a magnet installed on the other side of the swing nozzle so as to be able to adjust spacing relative to each other; and
a controller for receiving a sensing result of the sensor and performing a damping operation to the swing nozzle by providing power to the electromagnet to generate an attractive force or repulsive force between the electromagnet and the magnet.
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