US 11,938,329 B2
Implantable medical devices having circuitry located adjacent to header-related structures
Steven Deininger, Plymouth, MN (US); Jeffrey Clayton, Zimmerman, MN (US); Michael Baade, Otsego, MN (US); and Anthony Chasensky, St. Paul, MN (US)
Assigned to Medtronic, Inc., Minneapolis, MN (US)
Filed by MEDTRONIC, INC., Minneapolis, MN (US)
Filed on Jul. 12, 2021, as Appl. No. 17/372,522.
Application 17/372,522 is a continuation of application No. 16/273,133, filed on Feb. 11, 2019, granted, now 11,058,882.
Prior Publication US 2021/0339029 A1, Nov. 4, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. A61N 1/375 (2006.01); A61N 1/36 (2006.01); A61N 1/05 (2006.01)
CPC A61N 1/3754 (2013.01) [A61N 1/36062 (2017.08); A61N 1/37514 (2017.08); A61N 1/0551 (2013.01); A61N 1/36107 (2013.01); A61N 1/3756 (2013.01)] 24 Claims
OG exemplary drawing
 
1. An implantable medical device, comprising:
a housing;
a header affixed to the housing, the header providing a first lead bore and a second lead bore, the first lead bore and the second lead bore having a longitudinal centerline that are parallel and separated in a first dimension;
an electrical connector positioned within the first lead bore;
a circuit board within the housing, the circuit board including circuitry that is electrically coupled to the electrical connector, the circuit board having a side providing a largest surface area of the circuit board, the side defining a first plane, the first lead bore being positioned such that a second plane is parallel to the longitudinal centerline of the first, intersects the first lead bore but not the second lead bore, intersects the circuit board, and is perpendicular to the first plane.