US 11,938,314 B2
Method of manufacturing an implantable neural electrode interface platform
John Burns, IV, Cambridge, MA (US); Julianne Grainger, Boston, MA (US); Bryan McLaughlin, Cambridge, MA (US); Tirunelveli S. Sriram, Acton, MA (US); and John Lachapelle, Princeton, MA (US)
Assigned to The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US)
Filed by The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US)
Filed on Jul. 6, 2020, as Appl. No. 16/921,486.
Application 16/921,486 is a continuation of application No. 15/439,419, filed on Feb. 22, 2017, abandoned.
Claims priority of provisional application 62/298,272, filed on Feb. 22, 2016.
Prior Publication US 2021/0121687 A1, Apr. 29, 2021
Int. Cl. A61N 1/05 (2006.01); A61B 5/00 (2006.01); A61N 1/02 (2006.01); A61N 1/04 (2006.01); A61N 1/36 (2006.01); A61B 5/24 (2021.01); A61B 18/00 (2006.01)
CPC A61N 1/0551 (2013.01) [A61B 5/4041 (2013.01); A61B 5/4893 (2013.01); A61B 5/6877 (2013.01); A61N 1/02 (2013.01); A61N 1/048 (2013.01); A61N 1/05 (2013.01); A61N 1/0529 (2013.01); A61N 1/0534 (2013.01); A61N 1/0539 (2013.01); A61N 1/36185 (2013.01); A61B 5/24 (2021.01); A61B 2018/00434 (2013.01); A61B 2562/125 (2013.01); A61N 1/0492 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing an implantable neural electrode comprising:
cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces, wherein the metal layer is about 5 μm to 25 μm thick and wherein the metal traces connect one or more electrode sites to one or more contact pads;
forming a first silicone layer by:
knife-coating a polymer mesh with silicone, such that the first silicone layer has a thickness between about 50 μm and about 100 μm, and
curing the first silicone layer;
coupling the metal layer to the first silicone layer;
forming a second silicone layer by calendaring silicone to a thickness between about 50 μm and about 100 μm;
laminating the first silicone layer to the second silicone layer such that the metal layer is positioned between the first silicone layer and the second silicone layer;
forming a first set of holes in the first or second silicone layers to expose one or more electrode sites and a second set of holes in the first or second silicone layers to expose one or more contact pads in the metal layer;
after exposing the one or more contact pads, welding one or more wires to the one or more exposed contact pads; and
overmolding a third silicone layer over the one or more welded contact pads and a portion of the wires.