US 11,937,606 B2
Device for producing a wafer cup
Dieter Kempass, Kiel (DE)
Assigned to WALTERWERK KIEL GMBH & CO. KG, Kiel (DE)
Appl. No. 17/772,393
Filed by WALTERWERK KIEL GMBH & CO. KG, Kiel (DE)
PCT Filed Nov. 23, 2020, PCT No. PCT/EP2020/083037
§ 371(c)(1), (2) Date Apr. 27, 2022,
PCT Pub. No. WO2021/144054, PCT Pub. Date Jul. 22, 2021.
Claims priority of application No. 20000017 (EP), filed on Jan. 15, 2020.
Prior Publication US 2022/0378053 A1, Dec. 1, 2022
Int. Cl. A21C 15/02 (2006.01)
CPC A21C 15/025 (2013.01) 18 Claims
OG exemplary drawing
 
1. An apparatus for producing a wafer cup, comprising
a mold core and
a female mold, wherein the female mold has a base and a plurality of wall segments hingedly connected to the base, and
a hinge assembly for pivoting the wall segments from a first position in which the base forms a support configured to receive a wafer sheet that extends beyond the base into a second position in which the wall segments form a wall which encloses the base and extends substantially perpendicularly from the base, with the portions of the wafer sheet that extend beyond the region of the base being applied to the mold core, the mold core and the base are mounted so as to be displaceable relative to the hinge assembly,
wherein the hinge assembly has:
a housing having two levels arranged one above the other,
a first group of wall segments which are connected to the first level of the housing by a first group of arms, and
a second group of wall segments which are connected to the second level of the housing by a second group of arms, wherein
the arms are each hingedly connected at one end to the first level or the second level of the housing and at the other end to one wall segment of the first group or the second group, and
the wall segments of the first group of wall segments and the wall segments of the second group of wall segments are arranged alternately on the circumference of the base and being configured to form the wafer cup without holes or folds.