US 11,937,401 B2
System design and operation for liquid cooling
Tianyi Gao, Sunnyvale, CA (US)
Assigned to BAIDU USA LLC, Sunnyvale, CA (US)
Filed by Baidu USA LLC, Sunnyvale, CA (US)
Filed on Jun. 22, 2021, as Appl. No. 17/354,378.
Prior Publication US 2022/0408597 A1, Dec. 22, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20281 (2013.01) [H05K 7/20272 (2013.01); H05K 7/20254 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic rack, comprising:
a rack manifold to be coupled to an external cooling fluid source, including a supply rack manifold and a return rack manifold, wherein the rack manifold includes a plurality of pairs of rack connectors disposed thereon to receive and to return cooling fluid from and to the external cooling fluid source via the supply rack manifold and the return rack manifold;
a server chassis including a connector holder having a pair of a supply server connector and a return server connector to be connected with a corresponding pair of rack connectors of the rack manifold, wherein the supply and return server connectors are configured to distribute the cooling fluid to one or more cooling devices attached to one or more electronic devices contained within the server chassis for liquid cooling, wherein the server chassis further comprises a first electromagnetic device fixedly attached to the supply server connector, wherein a controller is to control the first electromagnetic device to disconnect the supply server connector from the supply rack manifold in response to detecting a leakage, wherein the server chassis further comprises a second electromagnetic device fixedly attached to the return server connector, wherein the controller is to control the second electromagnetic device to disconnect the return server connector from the return rack manifold in response to detecting the leakage; and
the controller, in response to detecting the leakage of the cooling fluid, configured to:
cause the supply server connector to disconnect from the supply rack manifold, while maintaining the return server connector connected with the return rack manifold, and
increase a flowrate of the cooling fluid on the return rack manifold to remove the cooling fluid residing within the server chassis.