US 11,935,799 B2
Integrated circuit package lids with polymer features
Elah Bozorg-Grayeli, Chandler, AZ (US); Taylor William Gaines, Chandler, AZ (US); Frederick W. Atadana, Chandler, AZ (US); Sergio Antonio Chan Arguedas, Chandler, AZ (US); and Robert F. Cheney, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 25, 2019, as Appl. No. 16/451,973.
Prior Publication US 2020/0411395 A1, Dec. 31, 2020
Int. Cl. H01L 23/06 (2006.01); H01L 23/053 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/06 (2013.01) [H01L 23/053 (2013.01); H01L 23/49816 (2013.01); H01L 23/3672 (2013.01); H01L 23/42 (2013.01); H01L 25/0655 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) package, comprising:
a package support;
a die; and
a lid comprising a planar metal portion and a foot, wherein the die is between the package support and the planar metal portion of the lid, the foot includes a metal portion that extends from the planar metal portion towards the package support, the foot further includes a polymer portion that extends from the metal portion of the foot to the package support, all of the metal portion of the foot is further away from the package support than all of the polymer portion, and a height of the polymer portion is at least 80% of a height of the foot and is greater than 150 microns.