US 11,935,796 B2
Temperature control for multiple die types in a common package
Mark A. Gustlin, Campbell, CA (US); and Rakesh Chopra, Menlo Park, CA (US)
Assigned to Cisco Technology, Inc., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Mar. 23, 2021, as Appl. No. 17/301,058.
Prior Publication US 2022/0310459 A1, Sep. 29, 2022
Int. Cl. H01L 21/66 (2006.01); H01L 23/473 (2006.01)
CPC H01L 22/12 (2013.01) [H01L 23/473 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method, comprising:
measuring a temperature of a first die, in an element comprising the first die and a second die, wherein the second die comprises at least a portion of a controller;
determining a target temperature for the first die based on a duration of time at which the first die has exceeded a first temperature limit, comprising at least one of:
determining that the first die has exceeded the first temperature limit for longer than a duration of time, and in response decreasing the target temperature, or
determining that the first die has not exceeded the first temperature limit for longer than the duration of time, and in response increasing the target temperature; and
changing the temperature of the first die by adjusting a volume of controller traffic transmitted from the second die to the first die, based on a target temperature for the first die and the measured temperature for the first die.