US 11,932,927 B2
Iron-based metal powder for ultra-high-speed laser cladding, its preparation method and its application
Miaohui Wang, Beijing (CN); Xueyuan Ge, Beijing (CN); Borui Du, Beijing (CN); Bowen Shen, Beijing (CN); Yifei Xu, Beijing (CN); Ning Xiao, Beijing (CN); and Sheng Hao, Beijing (CN)
Assigned to CHINA MACHINERY INSTITUTE OF ADVANCED MATERIALS (ZHENGZHOU) CO., LTD., (CN)
Filed by BEIJING NATIONAL INNOVATION INSTITUTE OF LIGHTWEIGHT LTD, Beijing (CN)
Filed on Dec. 28, 2020, as Appl. No. 17/135,064.
Prior Publication US 2021/0207251 A1, Jul. 8, 2021
Int. Cl. B23K 26/34 (2014.01); B22F 1/05 (2022.01); B22F 1/065 (2022.01); B22F 9/08 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/44 (2006.01); C22C 38/50 (2006.01); C22C 38/54 (2006.01); C22C 38/58 (2006.01)
CPC C22C 38/54 (2013.01) [B22F 1/05 (2022.01); B22F 1/065 (2022.01); B22F 9/082 (2013.01); B23K 26/34 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/44 (2013.01); C22C 38/50 (2013.01); C22C 38/58 (2013.01); B22F 2301/35 (2013.01); B22F 2304/10 (2013.01)] 5 Claims
 
1. An ultra-high-speed laser cladding process using an iron-based metal powder, comprising:
machining a surface of substrate;
wiping the surface of substrate with acetone to remove surface grease;
carrying out laser cladding path planning according to a geometry of the surface of substrate,
formulating process parameters; and
using Computerized Numerical Control (CNC) machine tools to machine the repaired substrate surface to obtain the required size;
wherein a semiconductor laser cladding system is used to clad and repair the surface of substrate with the following process parameters: laser power 1500˜2500 W, spot diameter 0.8˜1.2 mm, powder feeding rate 2˜5 kg/h, laser scanning rate 330˜830 m/min, overlap rate 40%˜70%, and single layer cladding thickness 250˜500 μm, wherein a laser cladding head with an argon gas protection function is used, and wherein an argon gas flow rate of 8˜20 L/min is used,
wherein the iron-based metal powder comprises: C at 0.6˜1.0%, Cr at 18.0˜20.0%, at Ni 5.0˜6.5% at Mn 2.0˜4.0%, at Mo 1.0˜1.5%, Ti at 4.0˜6.0%, B at 1.0˜1.5%, N at 0.08˜0.15%, Si at ≤0.5%, P at ≤0.030%, S at ≤0.030%, balance of Fe and unavoidable impurities.