US 11,931,855 B2
Planarization methods for packaging substrates
Han-Wen Chen, Cupertino, CA (US); Steven Verhaverbeke, San Francisco, CA (US); Tapash Chakraborty, Maharashtra (IN); Prayudi Lianto, Singapore (SG); Prerna Sonthalia Goradia, Mumbai (IN); Giback Park, San Jose, CA (US); Chintan Buch, Santa Clara, CA (US); Pin Gian Gan, Singapore (SG); and Alex Hung, Singapore (SG)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 28, 2020, as Appl. No. 16/885,753.
Claims priority of application No. 201941023935 (IN), filed on Jun. 17, 2019.
Prior Publication US 2020/0391343 A1, Dec. 17, 2020
Int. Cl. B24B 37/04 (2012.01); B24B 21/04 (2006.01); B24B 37/07 (2012.01); B24B 37/14 (2012.01)
CPC B24B 37/042 (2013.01) [B24B 21/04 (2013.01); B24B 37/14 (2013.01); B24B 37/07 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for planarization of a substrate, the method comprising:
positioning a substrate in a polishing apparatus, the substrate comprising a polymeric material;
exposing a polymer layer of a substrate surface of the substrate to a first polishing process, the first polishing process comprising:
delivering a grinding slurry to a polishing pad of the polishing apparatus, the grinding slurry comprising:
a first plurality of colloidal particles having a grit size between about 5 μm and about 53 μm, the first plurality of colloidal particles comprising a material selected from the group consisting of ferric oxide (Fe2O3), diamond (C), and boron nitride (BN);
a non-ionic polymer dispersion agent; and
an aqueous solvent; and
exposing the polymer layer of the substrate surface of the substrate to a second polishing process, the second polishing process comprising:
delivering a polishing slurry to the polishing pad of the polishing apparatus, the polishing slurry comprising:
a second plurality of colloidal particles having a grit size between about 25 nm and about 500 nm.