CPC B24B 37/042 (2013.01) [B24B 21/04 (2013.01); B24B 37/14 (2013.01); B24B 37/07 (2013.01)] | 20 Claims |
1. A method for planarization of a substrate, the method comprising:
positioning a substrate in a polishing apparatus, the substrate comprising a polymeric material;
exposing a polymer layer of a substrate surface of the substrate to a first polishing process, the first polishing process comprising:
delivering a grinding slurry to a polishing pad of the polishing apparatus, the grinding slurry comprising:
a first plurality of colloidal particles having a grit size between about 5 μm and about 53 μm, the first plurality of colloidal particles comprising a material selected from the group consisting of ferric oxide (Fe2O3), diamond (C), and boron nitride (BN);
a non-ionic polymer dispersion agent; and
an aqueous solvent; and
exposing the polymer layer of the substrate surface of the substrate to a second polishing process, the second polishing process comprising:
delivering a polishing slurry to the polishing pad of the polishing apparatus, the polishing slurry comprising:
a second plurality of colloidal particles having a grit size between about 25 nm and about 500 nm.
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