US 11,931,777 B2
Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods
Johannes Wilhelmus Weekamp, Beek en Donk (NL); Vincent Adrianus Henneken, Utrecht (NL); Alfons Wouter Groenland, Best (NL); and Marcus Cornelis Louwerse, Nijmegen (NL)
Assigned to KONINKLIJKE PHILIPS N.V., Eindhoven (NL)
Filed by KONINKLIJKE PHILIPS N.V., Eindhoven (NL)
Filed on Sep. 24, 2020, as Appl. No. 17/030,599.
Application 17/030,599 is a division of application No. 15/305,414, granted, now 10,814,352, previously published as PCT/EP2015/059769, filed on May 5, 2015.
Claims priority of application No. 14167101 (EP), filed on May 6, 2014.
Prior Publication US 2021/0114061 A1, Apr. 22, 2021
Int. Cl. B06B 1/06 (2006.01); A61B 8/00 (2006.01); G10K 11/00 (2006.01); H10N 30/063 (2023.01); H10N 30/30 (2023.01); H10N 30/87 (2023.01)
CPC B06B 1/0622 (2013.01) [A61B 8/4483 (2013.01); G10K 11/002 (2013.01); H10N 30/063 (2023.02); H10N 30/302 (2023.02); H10N 30/872 (2023.02)] 4 Claims
OG exemplary drawing
 
1. A method of manufacturing an ultrasonic transducer assembly, comprising:
providing a wafer including:
a first array of ultrasonic transducer chips, each having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements;
a second array of contact chips, each having a further main surface comprising a plurality of second contacts for contacting a signal processing assembly; and
a sacrificial region separating the first array from the second array;
forming a flexible interconnect extending over said sacrificial region from the first contacts to the second contacts, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact;
removing the sacrificial region to release the first array and the second array;
providing a backing material comprising ultrasound absorbing and/or scattering bodies;
providing the first array on a first surface of said backing material; and
providing the second array on a second surface of said backing material such that the flexible interconnect extends from the first array to the second array over said backing material.