US 10,237,991 B2
Electronic component
Nobuyuki Kondo, Yamato (JP); and Toshihiro Niitsu, Machida (JP)
Assigned to Molex, LLC, Lisle, IL (US)
Filed by Molex, LLC, Lisle, IL (US)
Filed on Nov. 2, 2017, as Appl. No. 15/801,658.
Claims priority of application No. 2016-230718 (JP), filed on Nov. 29, 2016.
Prior Publication US 2018/0153045 A1, May 31, 2018
Int. Cl. H01L 23/00 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); H01G 2/00 (2006.01); H01L 49/02 (2006.01)
CPC H05K 5/0091 (2013.01) [H01G 2/00 (2013.01); H01L 23/00 (2013.01); H01L 28/40 (2013.01); H05K 5/0247 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a housing;
a conductive terminal loaded on the housing;
an external conductive member loaded on the housing; and
a thin film-like insulator provided on a surface of the external conductive member facing the conductive terminal,
wherein a first gap between the external conductive member and the conductive terminal is defined by a protrusion formed on the housing or the external conductive member, and wherein a second gap smaller than the first gap exists between the insulator and the conductive terminal.