US D1,017,533 S
Semiconductor device
Shuhei Yokoyama, Tokyo (JP); and Shogo Shibata, Tokyo (JP)
Assigned to MITSUBISHI ELECTRIC CORPORATION, Tokyo (JP)
Filed by MITSUBISHI ELECTRIC CORPORATION, Tokyo (JP)
Filed on Jul. 11, 2022, as Appl. No. 29/865,154.
Claims priority of application No. 2022-001596 D (JP), filed on Jan. 28, 2022.
Term of patent 15 Years
LOC (14) Cl. 13 - 02
U.S. Cl. D13—103
OG exemplary drawing
 
The ornamental design for a semiconductor device, as shown and described.