CPC H10K 71/00 (2023.02) [B32B 37/003 (2013.01); B32B 37/0046 (2013.01); B32B 38/1866 (2013.01); H10K 50/841 (2023.02); B32B 2457/20 (2013.01); H10K 59/12 (2023.02); H10K 2102/311 (2023.02); Y10T 156/1028 (2015.01)] | 20 Claims |
1. A bonding device comprising:
a support in which a plurality of through-holes is defined;
a diaphragm disposed on the support to cover the support;
a pressing pad disposed on the diaphragm over a top surface of the support; and
a window fixing chuck disposed on the pressing pad and in which a groove facing the pressing pad is defined,
wherein the pressing pad comprises:
a pad; and
at least one support bar disposed in the pad and extending in a first direction.
|