US 11,930,689 B2
Bonding device and method of manufacturing display device using the same
Kisang Yoo, Asan-si (KR); Kyungrok Ko, Suwon-si (KR); Youngsu Kim, Gunpo-si (KR); Jaesuk Yoo, Seoul (KR); and Jeong-Seop Choi, Cheonan-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-do (KR)
Filed by Samsung Display Co., Ltd., Yongin-Si (KR)
Filed on Jun. 23, 2021, as Appl. No. 17/355,612.
Claims priority of application No. 10-2020-0114287 (KR), filed on Sep. 8, 2020.
Prior Publication US 2022/0077435 A1, Mar. 10, 2022
Int. Cl. B32B 37/00 (2006.01); B32B 38/18 (2006.01); H10K 50/84 (2023.01); H10K 71/00 (2023.01); H10K 59/12 (2023.01); H10K 102/00 (2023.01)
CPC H10K 71/00 (2023.02) [B32B 37/003 (2013.01); B32B 37/0046 (2013.01); B32B 38/1866 (2013.01); H10K 50/841 (2023.02); B32B 2457/20 (2013.01); H10K 59/12 (2023.02); H10K 2102/311 (2023.02); Y10T 156/1028 (2015.01)] 20 Claims
OG exemplary drawing
 
1. A bonding device comprising:
a support in which a plurality of through-holes is defined;
a diaphragm disposed on the support to cover the support;
a pressing pad disposed on the diaphragm over a top surface of the support; and
a window fixing chuck disposed on the pressing pad and in which a groove facing the pressing pad is defined,
wherein the pressing pad comprises:
a pad; and
at least one support bar disposed in the pad and extending in a first direction.