US 11,930,598 B2
Three dimensional printed resistor for downhole applications
Swapna Arun Kumar, Sugar Land, TX (US); and Srinand Karuppoor, Sugar Land, TX (US)
Assigned to Schlumberger Technology Corporation, Sugar Land, TX (US)
Filed by Schlumberger Technology Corporation, Sugar Land, TX (US)
Filed on Dec. 14, 2022, as Appl. No. 18/065,712.
Application 18/065,712 is a division of application No. 16/599,554, filed on Oct. 11, 2019, granted, now 11,533,809.
Prior Publication US 2023/0110573 A1, Apr. 13, 2023
Int. Cl. H05K 1/16 (2006.01); B22F 10/00 (2021.01); H01C 1/01 (2006.01); H01C 7/00 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/167 (2013.01) [B22F 10/00 (2021.01); H01C 1/01 (2013.01); H01C 7/006 (2013.01); H05K 1/0296 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for producing a downhole electrical component, comprising:
providing a non-conductive polymer substrate;
establishing an active area on the non-conductive polymer substrate;
patterning the active area on the non-conductive polymer substrate with one or more conductive materials through an additive manufacturing process to form a patterned non-conductive polymer substrate comprising a first resistive pattern, a second resistive pattern, a first connection pad, and a second connection pad, wherein a first end of each of the first and second resistive patterns is connected to the first connection pad and a second end of each of the first and second resistive patterns is connected to the second connection pad; and
incorporating the patterned non-conductive polymer substrate into a final arrangement.