CPC H05K 1/167 (2013.01) [B22F 10/00 (2021.01); H01C 1/01 (2013.01); H01C 7/006 (2013.01); H05K 1/0296 (2013.01)] | 19 Claims |
1. A method for producing a downhole electrical component, comprising:
providing a non-conductive polymer substrate;
establishing an active area on the non-conductive polymer substrate;
patterning the active area on the non-conductive polymer substrate with one or more conductive materials through an additive manufacturing process to form a patterned non-conductive polymer substrate comprising a first resistive pattern, a second resistive pattern, a first connection pad, and a second connection pad, wherein a first end of each of the first and second resistive patterns is connected to the first connection pad and a second end of each of the first and second resistive patterns is connected to the second connection pad; and
incorporating the patterned non-conductive polymer substrate into a final arrangement.
|