US 11,930,258 B2
Camera module, spacer component, and method for producing camera module
Hirofumi Owaki, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/785,013
Filed by Sony Semiconductor Solutions Corporation, Kanagawa (JP)
PCT Filed Dec. 11, 2020, PCT No. PCT/JP2020/046217
§ 371(c)(1), (2) Date Jun. 13, 2022,
PCT Pub. No. WO2021/125074, PCT Pub. Date Jun. 24, 2021.
Claims priority of application No. 2019-230753 (JP), filed on Dec. 20, 2019.
Prior Publication US 2023/0008374 A1, Jan. 12, 2023
Int. Cl. H04N 5/335 (2011.01); H01R 12/71 (2011.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01); H05K 1/02 (2006.01); H05K 13/00 (2006.01)
CPC H04N 23/52 (2023.01) [H01R 12/716 (2013.01); H04N 23/54 (2023.01); H05K 1/0209 (2013.01); H05K 13/0015 (2013.01); H01R 2201/18 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/1059 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A camera module, comprising:
a first component-mounting board that includes an imaging device;
a second component-mounting board that is electrically connected to the first component-mounting board; and
a spacer component that is arranged between the first component-mounting board and the second component-mounting board,
the spacer component including a component body that is made of a first insulating material, the component body including a first primary-surface portion that includes a plurality of first reference surfaces including at least three first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces including at least three second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with the first component-mounting board, the second primary-surface portion being brought into contact with the second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.