US 11,929,739 B2
Bulk acoustic wave filter co-package
Akshara Kankar, Irvine, CA (US); Tomoya Komatsu, Irvine, CA (US); Abhishek Dey, Greensboro, NC (US); Nan Wu, Irvine, CA (US); and Stephane Richard Marie Wloczysiak, Irvine, CA (US)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Woburn, MA (US)
Filed on Dec. 18, 2020, as Appl. No. 17/126,949.
Application 17/126,949 is a continuation of application No. 16/937,472, filed on Jul. 23, 2020, granted, now 11,323,097.
Claims priority of provisional application 62/878,135, filed on Jul. 24, 2019.
Claims priority of provisional application 62/878,209, filed on Jul. 24, 2019.
Claims priority of provisional application 62/878,189, filed on Jul. 24, 2019.
Prior Publication US 2021/0105006 A1, Apr. 8, 2021
Int. Cl. H03H 9/70 (2006.01); H03F 3/19 (2006.01); H03H 3/02 (2006.01); H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/17 (2006.01); H03H 9/56 (2006.01); H04B 1/38 (2015.01)
CPC H03H 9/706 (2013.01) [H03F 3/19 (2013.01); H03H 3/02 (2013.01); H03H 9/02118 (2013.01); H03H 9/0523 (2013.01); H03H 9/0542 (2013.01); H03H 9/105 (2013.01); H03H 9/173 (2013.01); H03H 9/176 (2013.01); H03H 9/562 (2013.01); H03H 9/564 (2013.01); H03H 9/568 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01); H03H 2003/021 (2013.01); H04B 1/38 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multi-filter package comprising:
a multi-filter die including at least a first filter and a second filter, the first filter including a first plurality of bulk acoustic wave resonators with raised frame structures, the second filter including a second plurality of bulk acoustic wave resonators with raised frame structures, a first frequency differential between two operating frequencies of the first plurality of bulk acoustic wave resonators being equal to a second frequency differential between two operating frequencies of the second plurality of bulk acoustic wave resonators;
at least first, second, and third internal interconnect structures that provide electrical connections between a first surface of a packaging substrate and an internal surface of the multi-filter die, at least one conductive trace on the first surface of the packaging substrate provides a shared electrical connection for the first and second filters; and
a packaging structure bonded to a periphery of the first surface of the packaging substrate to form a package encapsulating the multi-filter die.