CPC H03H 9/706 (2013.01) [H03F 3/19 (2013.01); H03H 3/02 (2013.01); H03H 9/02118 (2013.01); H03H 9/0523 (2013.01); H03H 9/0542 (2013.01); H03H 9/105 (2013.01); H03H 9/173 (2013.01); H03H 9/176 (2013.01); H03H 9/562 (2013.01); H03H 9/564 (2013.01); H03H 9/568 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01); H03H 2003/021 (2013.01); H04B 1/38 (2013.01)] | 20 Claims |
1. A multi-filter package comprising:
a multi-filter die including at least a first filter and a second filter, the first filter including a first plurality of bulk acoustic wave resonators with raised frame structures, the second filter including a second plurality of bulk acoustic wave resonators with raised frame structures, a first frequency differential between two operating frequencies of the first plurality of bulk acoustic wave resonators being equal to a second frequency differential between two operating frequencies of the second plurality of bulk acoustic wave resonators;
at least first, second, and third internal interconnect structures that provide electrical connections between a first surface of a packaging substrate and an internal surface of the multi-filter die, at least one conductive trace on the first surface of the packaging substrate provides a shared electrical connection for the first and second filters; and
a packaging structure bonded to a periphery of the first surface of the packaging substrate to form a package encapsulating the multi-filter die.
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