US 11,929,729 B2
Wafer level package and method of manufacture
Markus Schieber, Munich (DE)
Assigned to RF360 Singapore Pte. Ltd., Republic Plaza (SG)
Appl. No. 15/734,202
Filed by RF360 SINGAPORE PTE. LTD., Singapore (SG)
PCT Filed Apr. 16, 2019, PCT No. PCT/EP2019/059777
§ 371(c)(1), (2) Date Dec. 1, 2020,
PCT Pub. No. WO2019/233667, PCT Pub. Date Dec. 12, 2019.
Claims priority of application No. 102018113218.2 (DE), filed on Jun. 4, 2018.
Prior Publication US 2021/0226605 A1, Jul. 22, 2021
Int. Cl. H03H 9/10 (2006.01); H03H 3/02 (2006.01); H03H 3/08 (2006.01); H03H 9/02 (2006.01); H10N 30/02 (2023.01); H10N 30/06 (2023.01); H10N 30/87 (2023.01); H10N 30/88 (2023.01)
CPC H03H 9/1071 (2013.01) [H03H 3/02 (2013.01); H03H 3/08 (2013.01); H03H 9/02086 (2013.01); H03H 9/02913 (2013.01); H03H 9/1014 (2013.01); H10N 30/02 (2023.02); H10N 30/06 (2023.02); H10N 30/875 (2023.02); H10N 30/883 (2023.02)] 6 Claims
OG exemplary drawing
 
1. A wafer level package, comprising:
a functional wafer with a first surface;
device structures connected to device pads arranged on the first surface;
a cap wafer having an inner surface and an outer surface, the inner surface being bonded to the first surface of the functional wafer;
a frame structure surrounding the device structures and being arranged between the functional wafer and the cap wafer;
connection posts connecting the device pads on the first surface to inner cap pads on the inner surface;
electrically conducting vias guided through the cap wafer connecting the inner cap pads on the inner surface and package pads on the outer surface of the cap wafer
a bridging line on the inner surface connecting two of the connection posts; and
a conductor line on the first surface, wherein an air gap exists between the bridging line and the conductor line such that the bridging line and the conductor line form a contactless line crossing.