CPC H03H 3/08 (2013.01) [H03H 9/02661 (2013.01); H03H 9/02834 (2013.01); H03H 9/059 (2013.01); H03H 9/14538 (2013.01)] | 15 Claims |
1. A method for fabricating a surface acoustic wave (SAW) device, comprising:
forming an interdigital transducer (IDT) having lead-out portions and arrays of interdigital electrodes on a substrate, wherein the arrays of interdigital electrodes include central portions, end portions, and intermediate portions between the end portions and the lead-out portions;
forming a protective layer on the IDT;
forming a first temperature compensation layer on the protective layer;
forming openings in the first temperature compensation layer to expose portions of the protective layer on the central portions and the intermediate portions of the arrays of interdigital electrodes;
etching the exposed portions of the protective layer, and etching the central portions and the intermediate portions of the arrays of interdigital electrodes to a preset thickness, to form protruding structures at the end portions of the arrays of interdigital electrodes;
forming a second temperature compensation layer on the first temperature compensation layer and on the central portions and the intermediate portions of the arrays of interdigital electrodes; and
forming a passivation layer on the second temperature compensation layer.
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