US 11,929,724 B2
Surface acoustic wave device and fabrication method thereof
Jian Wang, Shenzhen (CN)
Assigned to Shenzhen Newsonic Technologies Co., Ltd., Shenzhen (CN)
Filed by Shenzhen Newsonic Technologies Co., Ltd., Shenzhen (CN)
Filed on May 30, 2023, as Appl. No. 18/325,220.
Claims priority of application No. 202310466673.5 (CN), filed on Apr. 19, 2023.
Prior Publication US 2023/0308075 A1, Sep. 28, 2023
Int. Cl. H03H 3/08 (2006.01); H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/145 (2006.01)
CPC H03H 3/08 (2013.01) [H03H 9/02661 (2013.01); H03H 9/02834 (2013.01); H03H 9/059 (2013.01); H03H 9/14538 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for fabricating a surface acoustic wave (SAW) device, comprising:
forming an interdigital transducer (IDT) having lead-out portions and arrays of interdigital electrodes on a substrate, wherein the arrays of interdigital electrodes include central portions, end portions, and intermediate portions between the end portions and the lead-out portions;
forming a protective layer on the IDT;
forming a first temperature compensation layer on the protective layer;
forming openings in the first temperature compensation layer to expose portions of the protective layer on the central portions and the intermediate portions of the arrays of interdigital electrodes;
etching the exposed portions of the protective layer, and etching the central portions and the intermediate portions of the arrays of interdigital electrodes to a preset thickness, to form protruding structures at the end portions of the arrays of interdigital electrodes;
forming a second temperature compensation layer on the first temperature compensation layer and on the central portions and the intermediate portions of the arrays of interdigital electrodes; and
forming a passivation layer on the second temperature compensation layer.