US 11,929,569 B2
Circuit board, method for producing circuit board, and imaging apparatus
Takayoshi Shimizu, Kanagawa (JP)
Assigned to RICOH COMPANY, LTD., Tokyo (JP)
Appl. No. 17/289,107
Filed by RICOH COMPANY, LTD., Tokyo (JP)
PCT Filed Nov. 19, 2019, PCT No. PCT/JP2019/045272
§ 371(c)(1), (2) Date Apr. 27, 2021,
PCT Pub. No. WO2020/110828, PCT Pub. Date Jun. 4, 2020.
Claims priority of application No. 2018-225441 (JP), filed on Nov. 30, 2018.
Prior Publication US 2021/0328373 A1, Oct. 21, 2021
Int. Cl. H01R 12/79 (2011.01); H01R 12/77 (2011.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01)
CPC H01R 12/79 (2013.01) [H01R 12/771 (2013.01); H05K 1/118 (2013.01); H05K 3/005 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A circuit board, comprising:
a board body; and
a pair of connection portions disposed at both ends of the board body, each of the pair of connection portions being inserted into a connector,
wherein each of the pair of connection portions includes a connection terminal electrically connected to the connector,
at least one of the pair of connection portions includes an extending portion extending from the connection terminal to an insertion leading end of the at least one of the pair of connection portion, the extending portion being a plated lead including metal,
the extending portion is disposed at a position to avoid a virtual line extending in an insertion direction through a position where the connector and the connection terminal are electrically connected, and
the at least one of the pair of connection portions includes the extending portion that extends from the connection terminal to the insertion leading end of the at least one of the pair of connection portions.