US 11,929,489 B2
Electrode plate and manufacturing method for electrode plate
Sokichi Okubo, Okazaki (JP); Tomoyuki Uezono, Okazaki (JP); Momoka Miyajima, Toyota (JP); Nagisa Shimasaki, Nagoya (JP); Masaki Watanabe, Seto (JP); and Miyuki Matsuyama, Toyota (JP)
Assigned to PRIME PLANET ENERGY & SOLUTIONS, INC., Tokyo (JP); and TOYOTA JIDOSHA KABUSHIKI KAISHA, Aichi-ken (JP)
Filed by Prime Planet Energy & Solutions, Inc., Tokyo (JP); and TOYOTA JIDOSHA KABUSHIKI KAISHA, Aichi-ken (JP)
Filed on Feb. 3, 2022, as Appl. No. 17/592,455.
Claims priority of application No. 2021-027510 (JP), filed on Feb. 24, 2021.
Prior Publication US 2022/0271270 A1, Aug. 25, 2022
Int. Cl. H01M 4/139 (2010.01); H01M 4/04 (2006.01); H01M 4/36 (2006.01); H01M 10/0525 (2010.01)
CPC H01M 4/139 (2013.01) [H01M 4/0404 (2013.01); H01M 4/043 (2013.01); H01M 4/0471 (2013.01); H01M 4/366 (2013.01); H01M 10/0525 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A method of manufacturing an electrode plate including an electrode layer on a surface of a current collecting foil, the method comprising:
deposition-layer forming of forming a deposition layer, in which a plurality of active material particles and a plurality of binder particles are deposited and no solvent is included, on the surface of the current collecting foil; and
heat pressing of forming the electrode layer on the surface of the current collecting foil by heating and compressing a deposition-layer-formed current collecting foil, in which the deposition layer exists on the surface of the current collecting foil, by a pair of heat press portions of a heat pressing device, wherein
the deposition-layer forming includes: before the heat pressing,
forming a first deposition layer placed on a side of the current collecting foil and having the active material particles and the binder particles; and
forming a second deposition layer constituting a surface of the deposition layer,
in the forming of the second deposition layer, the active material particles with no binder particles are directly deposited on the first deposition layer,
the second deposition layer is formed to have a thickness of 10 to 20 μm on the first deposition layer, and
the second deposition layer is thinner than the first deposition layer.