US 11,929,452 B2
Method of manufacturing light-emitting device and method of manufacturing illumination device
Tsuyoshi Okahisa, Tokushima (JP); Tomohito Shinomiya, Anan (JP); and Daizo Kiba, Itano-gun (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Dec. 20, 2022, as Appl. No. 18/085,045.
Application 18/085,045 is a division of application No. 17/024,323, filed on Sep. 17, 2020, granted, now 11,575,073.
Claims priority of application No. 2019-170635 (JP), filed on Sep. 19, 2019.
Prior Publication US 2023/0121785 A1, Apr. 20, 2023
Int. Cl. H01L 33/48 (2010.01); H01L 33/58 (2010.01)
CPC H01L 33/483 (2013.01) [H01L 33/58 (2013.01); H01L 2933/0058 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method for manufacturing a light-emitting device, the method comprising steps of:
forming a cover, which comprises:
sandwiching a fixing member by a molding device,
injecting a light-transmissive material into a space defined in the molding device, and
hardening or curing the injected light-transmissive material,
wherein the formed cover comprises an upper portion, a sidewall extending along a peripheral edge of the upper portion, and a recess defined by the upper portion and the sidewall, the cover being integrated with the fixing member such that the fixing member projects from a part of an outer lateral surface of the sidewall;
disposing a light-transmissive member on a light extraction surface of a light-emitting element to be disposed on a substrate; and
disposing the cover so that the light-emitting element is housed in the recess,
wherein the fixing member is formed of a material that is deformable due to a pressing force generated upon engagement of the fixing member with a counterpart member.