CPC H01L 24/18 (2013.01) [G06F 13/14 (2013.01); G06F 13/385 (2013.01); G06F 13/4221 (2013.01); G06F 13/4265 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01)] | 20 Claims |
1. An integrated circuit device comprising:
an interposer comprising a first electrical trace and a second electrical trace;
a first die, coupled to the interposer, comprising a first plurality of package bumps; and
a second die, coupled to the interposer, comprising a second plurality of package bumps, wherein the first plurality of package bumps has a first closest pitch between package bumps of the first plurality of package bumps and the second plurality of package bumps has a second closest pitch between package bumps of the second plurality of package bumps, the first closest pitch is shorter than the second closest pitch, the first electrical trace couples a first package bump of the first plurality of package bumps with a second package bump of the second plurality of package bumps, and the second electrical trace couples a third package bump of the first plurality of package bumps with a fourth package bump of the second plurality of package bumps.
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