CPC H01L 21/78 (2013.01) [H01L 21/0274 (2013.01); H01L 21/268 (2013.01); H01L 21/32 (2013.01); H01L 21/32051 (2013.01); H01L 21/32131 (2013.01); H01L 22/20 (2013.01); H01L 23/544 (2013.01); H01L 2223/5446 (2013.01)] | 20 Claims |
1. A method of aligning a substrate, the method comprising:
forming a plurality of die on a first side of the substrate;
thinning a second side of the substrate and forming an edge ring through the thinning;
forming a backside metal layer on the second side of the substrate;
applying a photoresist layer over the backside metal layer; and
aligning the substrate from the second side of the substrate using a plurality of alignment features comprised one of in the edge ring or on the photoresist layer.
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