US 11,929,210 B2
Multi-layer ceramic electronic component and circuit board
Tomohiko Zaima, Tokyo (JP); Takashi Sasaki, Tokyo (JP); and Kunihiro Matsushita, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Mar. 16, 2022, as Appl. No. 17/696,651.
Claims priority of application No. 2021-051014 (JP), filed on Mar. 25, 2021.
Prior Publication US 2022/0310324 A1, Sep. 29, 2022
Int. Cl. H01G 4/26 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01); H05K 1/18 (2006.01)
CPC H01G 4/248 (2013.01) [H01G 4/30 (2013.01); H05K 1/181 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A multi-layer ceramic electronic component, comprising:
a ceramic body including
a main surface, an end surface, and a side surface that are respectively perpendicular to a first axis, a second axis, and a third axis orthogonal to one another,
a top portion that connects the main surface, the end surface, and the side surface to one another, and
a plurality of internal electrodes laminated in a direction of the first axis; and
an end external electrode including
a corner portion located on the top portion,
a base portion that covers the end surface and extends from the end surface to the main surface and the side surface, and
a protrusion that protrudes from the base portion in a thickness direction, the protrusion including an L-shaped main surface protrusion that is located on the main surface and extends in a direction of the second axis and in a direction of the third axis from the corner portion.