US 11,928,538 B2
Systems and methods for laser tuning and attaching RFID tags to products
Steve E. Trivelpiece, Santa Margarita, CA (US); Adam S. Bergman, Boca Raton, FL (US); Amin Shahidi, Milwaukee, WI (US); George H. West, Wellington, FL (US); Bjoern Petersen, Lubbock, TX (US); João Vilaça, Dubai (AE); Gopal Chandramowle, Boca Raton, FL (US); Carlos Gomez Garcia, Las Rozas (ES); and Melwyn F. Sequeira, Boca Raton, FL (US)
Assigned to Sensormatic Electronics, LLC, Boca Raton, FL (US)
Filed by Sensormatic Electronics, LLC, Boca Raton, FL (US)
Filed on Aug. 16, 2022, as Appl. No. 17/819,983.
Application 17/819,983 is a continuation of application No. 17/025,890, filed on Sep. 18, 2020, granted, now 11,443,160, issued on Sep. 13, 2022.
Application 17/025,890 is a continuation in part of application No. 16/685,508, filed on Nov. 15, 2019, granted, now 10,783,424, issued on Sep. 22, 2020.
Application 16/685,508 is a continuation in part of application No. 16/685,584, filed on Nov. 15, 2019, granted, now 10,970,613, issued on Apr. 6, 2021.
Claims priority of provisional application 62/902,355, filed on Sep. 18, 2019.
Prior Publication US 2022/0391657 A1, Dec. 8, 2022
Prior Publication US 2023/0267298 A9, Aug. 24, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G06K 19/07 (2006.01); G06K 19/077 (2006.01)
CPC G06K 19/07758 (2013.01) 24 Claims
OG exemplary drawing
 
1. A method for producing a radio frequency identification (RFID) tag, comprising:
altering a conductive trace by removing a portion of conductive material of the conductive trace using a laser to have a characteristic to define an antenna for the RFID tag; and
attaching a communications enabled device so as to form an electrical connection between the communications enabled device and the antenna to form the RFID tag;
wherein the removing the portion of the conductive material in an area of the conductive trace using the laser includes at least one of decreasing a thickness of the conductive trace, decreasing a width of the conductive trace, or decreasing a height of the conductive trace while leaving a remaining portion in the area of the conductive material.