US 11,928,534 B2
Method of using an RFID label on a high-temperature product
Dan Schroer, Wapakoneta, OH (US)
Assigned to PRINT MANAGEMENT PARTNERS, INC., Des Plaines, IL (US)
Filed by Print Management Partners, Inc., Des Plaines, IL (US)
Filed on May 17, 2022, as Appl. No. 17/746,770.
Prior Publication US 2023/0376716 A1, Nov. 23, 2023
Int. Cl. G06K 19/02 (2006.01); G06K 19/077 (2006.01)
CPC G06K 19/02 (2013.01) [G06K 19/0776 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of using a high-temperature radio frequency identification (RFID) label, the method comprising:
providing a label, the label including a pressure-sensitive polymeric material, a liner, and an adhesive located between the pressure-sensitive polymeric material and the liner;
providing an RFID tag, the RFID tag including an RFID chip or integrated circuit and an antenna, the RFID tag being located at least partially inside of the label to form the high-temperature RFID label;
removing a portion of the liner from the high-temperature RFID label; and
attaching the high temperature RFID label on a product during the manufacturing of the product, the product exceeding a temperature of at least 500° F. during the attaching, the high-temperature RFID label being located outside of a periphery of the product.