US 11,927,890 B1
Substrate processing apparatus and method of fabricating semiconductor device using the same
Seok Heo, Suwon-si (KR); Cha Won Koh, Suwon-si (KR); Sang Joon Hong, Suwon-si (KR); Hyun Woo Kim, Suwon-si (KR); Kyung-Won Kang, Suwon-si (KR); Dong-Wook Kim, Suwon-si (KR); Kyung Won Seo, Suwon-si (KR); Young Il Jang, Suwon-si (KR); and Yong Suk Choi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Aug. 22, 2022, as Appl. No. 17/892,379.
Claims priority of application No. 10-2021-0111663 (KR), filed on Aug. 24, 2021; and application No. 10-2022-0085634 (KR), filed on Jul. 12, 2022.
Int. Cl. G03F 7/00 (2006.01); G03F 7/16 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC G03F 7/70875 (2013.01) [G03F 7/168 (2013.01); G03F 7/70033 (2013.01); H01L 21/67703 (2013.01); H01L 21/68707 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a photoresist coater configured to apply a photoresist film on a substrate;
a humidifier configured to increase an amount of moisture in an ambient to which the photoresist film on the substrate is exposed;
an exposer configured to irradiate the photoresist film exposed to the ambient having the increased amount of moisture with light, wherein the humidifier is disposed between the photoresist coater and the exposer;
a substrate stocker disposed between the photoresist coater and the exposer;
a plurality of baking chambers facing the photoresist coater and configured to bake the substrate provided from the photoresist coater; and
a dehumidifier configured to reduce an amount of moisture in an ambient to which the exposed substrate provided from the exposer is exposed, wherein the dehumidifier is stacked with the substrate stocker or the plurality of baking chambers.