US 11,927,558 B2
Microelectrode, method of manufacturing same, and integrated device
Tetsuhiko Teshima, Musashino (JP); Yuko Ueno, Musashino (JP); Yui Ogawa, Musashino (JP); Yoshiaki Kashimura, Musashino (JP); Satoshi Sasaki, Musashino (JP); Shengnan Wang, Musashino (JP); Makoto Takamura, Musashino (JP); and Hiroshi Nakashima, Musashino (JP)
Assigned to Nippon Telegraph and Telephone Corporation, Tokyo (JP)
Appl. No. 17/255,341
Filed by Nippon Telegraph and Telephone Corporation, Tokyo (JP)
PCT Filed Jul. 3, 2019, PCT No. PCT/JP2019/026472
§ 371(c)(1), (2) Date Dec. 22, 2020,
PCT Pub. No. WO2020/009152, PCT Pub. Date Jan. 9, 2020.
Claims priority of application No. 2018-127882 (JP), filed on Jul. 4, 2018.
Prior Publication US 2021/0270764 A1, Sep. 2, 2021
Int. Cl. G01N 27/30 (2006.01); G01N 27/327 (2006.01)
CPC G01N 27/327 (2013.01) [G01N 27/305 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A method of producing a microelectrode with a three-dimensional curved shape, the method comprising steps of:
(a) forming a layered member comprising:
a polymer compound layer which is a layer comprising a polymer compound having an aromatic ring, wherein a thickness of the polymer compound layer is 10 to 900 nm, and
a conductive layer which is a layer comprising a conductive material, wherein a thickness of the conductive layer is 0.3 to 10 nm; and
(b) allowing the layered member to form a three-dimensional curved shape in a self-organized manner, using a strain gradient in a thickness direction of the layered member as a driving force.