US 11,927,484 B2
Color measurement apparatus
Haruki Miyasaka, Matsumoto (JP); and Sho Aruga, Chino (JP)
Assigned to Seiko Epson Corporation, Tokyo (JP)
Filed by Seiko Epson Corporation, Tokyo (JP)
Filed on Nov. 9, 2021, as Appl. No. 17/522,104.
Claims priority of application No. 2020-188733 (JP), filed on Nov. 12, 2020.
Prior Publication US 2022/0146314 A1, May 12, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G01J 3/50 (2006.01); G01J 3/02 (2006.01); G01J 3/04 (2006.01); G02B 5/28 (2006.01)
CPC G01J 3/50 (2013.01) [G01J 3/0237 (2013.01); G01J 3/04 (2013.01); G02B 5/284 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A color measurement apparatus comprising:
an opening portion forming member that is a member in which an opening portion for causing light arriving from a measurement target to enter inside the apparatus is formed, and that is arranged on a bottom surface at a time of measurement performed by the apparatus;
an incident light processing portion that processes light incident through the opening portion;
a light emission portion that emits light toward the measurement target;
a first circuit substrate in which the incident light processing portion is disposed;
a second circuit substrate in which the light emission portion is disposed, the second circuit substrate being separate from and vertically below the first circuit substrate at the time of measurement performed by the apparatus, in order from the bottom surface upwardly in a first direction which is a vertical direction intersecting the bottom surface and an upper surface which is a surface on an opposite side form the bottom surface, the second circuit substrate and the first circuit substrate are arranged in an overlapping manner; and
a frame assembly that is formed of a metal material, and in which the first circuit substrate and the second circuit substrate are disposed, wherein
the frame assembly includes
a main frame that forms a base of the apparatus,
a first subframe that holds the first circuit substrate, and
a second subframe that holds the second circuit substrate, and
the first subframe and the second subframe are in direct or indirect contact with the main frame.