US 11,926,931 B2
Resin powder for solid freeform fabrication, device for solid freeform fabrication object, and method of manufacturing solid freeform fabrication object
Akira Saito, Kanagawa (JP); Shigenori Yaguchi, Tokyo (JP); Yasuyuki Yamashita, Kanagawa (JP); Kiichi Kamoda, Kangawa (JP); Yasuo Suzuki, Shizuoka (JP); Nozomu Tamoto, Shizuoka (JP); Hitoshi Iwatsuki, Kanagawa (JP); Shinzo Higuchi, Tokyo (JP); and Sohichiroh Iida, Kanagawa (JP)
Assigned to Ricoh Company, Ltd., Tokyo (JP)
Filed by RICOH COMPANY, LTD., Tokyo (JP)
Filed on Jun. 14, 2021, as Appl. No. 17/346,497.
Application 17/346,497 is a continuation of application No. 15/656,214, filed on Jul. 21, 2017, granted, now 11,066,758.
Claims priority of application No. 2016-144869 (JP), filed on Jul. 22, 2016; application No. 2017-049026 (JP), filed on Mar. 14, 2017; application No. 2017-111489 (JP), filed on Jun. 6, 2017; and application No. 2017-138273 (JP), filed on Jul. 14, 2017.
Prior Publication US 2021/0317601 A1, Oct. 14, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. D01F 6/00 (2006.01); B05D 3/06 (2006.01); B33Y 70/00 (2020.01); C08J 3/12 (2006.01); C08K 3/04 (2006.01); C08K 3/16 (2006.01); C08K 3/22 (2006.01); C08K 5/1575 (2006.01); C08K 5/527 (2006.01); C08K 7/14 (2006.01); C08K 7/20 (2006.01); D01F 1/07 (2006.01); D01F 1/10 (2006.01); D01F 6/06 (2006.01); D01F 6/66 (2006.01); D01F 6/80 (2006.01); D01F 6/84 (2006.01); B33Y 70/10 (2020.01)
CPC D01F 6/665 (2013.01) [B05D 3/06 (2013.01); B33Y 70/00 (2014.12); C08J 3/12 (2013.01); C08K 3/046 (2017.05); C08K 3/16 (2013.01); C08K 3/2279 (2013.01); C08K 5/1575 (2013.01); C08K 5/527 (2013.01); C08K 7/14 (2013.01); C08K 7/20 (2013.01); D01F 1/07 (2013.01); D01F 1/10 (2013.01); D01F 6/06 (2013.01); D01F 6/66 (2013.01); D01F 6/80 (2013.01); D01F 6/84 (2013.01); B33Y 70/10 (2020.01); C08J 2323/12 (2013.01); C08J 2329/14 (2013.01); C08J 2367/02 (2013.01); C08J 2371/00 (2013.01); C08J 2377/06 (2013.01); Y10T 428/2982 (2015.01)] 19 Claims
OG exemplary drawing
 
1. A resin powder, comprising particles,
wherein the particle have a 50 percent cumulative volume particle diameter of from 5 to 200 μm,
a ratio (Mv/Mn) of a volume average particle diameter (Mv) to a number average particle diameter (Mn) of the particles is 2.00 or less, and
the resin powder has an average circularity of 083 to 0.98 in a range in which the resin powder has a particle diameter of from 0.5 to 200 μm, and
said resin powder comprises particles having a pillar-like form having no points at ends.