	US 11,926,903 B2
	Etching of alkali metal compounds
Nitin Deepak, Maharashtra (IN); Tapash Chakraborty, Maharashtra (IN); Prerna Sonthalia Goradia, Mumbai (IN); Visweswaren Sivaramakrishnan, Cupertino, CA (US); Nilesh Chimanrao Bagul, Bangalore (IN); and Bahubali S. Upadhye, Bangalore (IN)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 9, 2022, as Appl. No. 17/836,578.
Claims priority of application No. 202141025658 (IN), filed on Jun. 9, 2021.
Prior Publication US 2022/0396732 A1, Dec. 15, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C23F 1/00 (2006.01); C09K 13/00 (2006.01); C23F 1/10 (2006.01); C23F 1/12 (2006.01); C23F 1/44 (2006.01); C23F 4/02 (2006.01)

CPC C23F 1/00 (2013.01) [C09K 13/00 (2013.01); C23F 1/10 (2013.01); C23F 1/12 (2013.01); C23F 1/44 (2013.01); C23F 4/02 (2013.01)]

20 Claims

1. A method of etching an alkali metal compound, the method comprising exposing the alkali metal compound to an alcohol for a pulse time to form a volatile metal alkoxide and purging the volatile metal alkoxide for a purge time.