CPC C23C 16/45557 (2013.01) [B01J 3/006 (2013.01); B01J 3/02 (2013.01); B01J 3/03 (2013.01); C23C 16/14 (2013.01); C23C 16/45527 (2013.01); C23C 16/52 (2013.01)] | 3 Claims |
1. A pressurization type apparatus for manufacturing elementary metal, the pressurization type apparatus comprising:
an inlet into which a metal precursor gas consisting of metal precursors, an inert gas, a reaction gas, and an inert gas are sequentially provided;
a chamber connected to the inlet and configured to receive a substrate;
an outlet through which a gas injected in the chamber is exhausted;
a metal precursor gas storage unit for storing the metal precursor gas, an inert gas storage unit for storing the inert gas, and a reaction gas storage unit for storing the reaction gas;
a metal precursor gas control valve positioned between the metal precursor gas storage unit and the inlet and configured to regulate the flow of the metal precursor gas, an inert gas control value positioned between the inert gas storage unit and the inlet and configured to regulate the flow of the inert gas, and a reaction gas control valve positioned between the reaction gas storage unit and the inlet and configured to regulate the flow of the reaction gas; and
a controller configured to
open the metal precursor gas control valve and close the outlet valve to provide the metal precursor gas into the chamber and increase a pressure in the chamber to adsorb the metal precursor gas onto the substrate in a state where an inside of the chamber having the substrate is sealed by closing the outlet for a first sub-pressurization metal precursor dosing operation,
open both the inert gas control valve and the outlet valve for a sub-purging operation after the first sub-pressurization metal precursor dosing operation,
open the metal precursor gas control valve and close the outlet valve to provide the metal precursor gas into the chamber and increase the pressure in the chamber to adsorb the metal precursor gas onto the substrate in a state where the inside of the chamber having the substrate is sealed by closing the outlet for a second sub-pressurization metal precursor dosing operation after the sub-purging operation,
open both the inert gas control valve and the outlet valve for a first main purging operation after the second sub-pressurization metal precursor dosing operation,
open the reaction gas control valve to provide the reaction gas into the chamber for a reaction gas dosing operation after the first main purging operation, and
then open both the inert gas control valve and the outlet valve for a second main purging operation after the reaction gas dosing operation,
wherein the controller is configured such that the first sub-pressurization metal precursor dosing operation and the second sub-pressurization metal precursor dosing operation are consecutively performed.
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