CPC C09J 11/06 (2013.01) [B32B 43/006 (2013.01); C09J 5/06 (2013.01); C09J 183/04 (2013.01); H01L 21/6836 (2013.01); C09J 2400/146 (2013.01); C09J 2483/00 (2013.01); H01L 2221/68386 (2013.01)] | 13 Claims |
1. An adhesive composition for use in debonding with light irradiation, which composition can achieve debonding through irradiation with light, wherein:
the adhesive composition comprises:
an adhesive component (S) that is curable through hydrosilyation, and
a light-absorbing organic compound (X); and
the light-absorbing organic compound (X) contains, in the molecule thereof, one or more aromatic rings, one or more rings each containing a heteroatom forming the ring, and one or more groups selected from among a carbonyl group and a thiocarbonyl group,
wherein the carbon atoms of the carbonyl or thiocarbonyl group constitute the ring that contains the hetereatom in the ring.
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