US 11,926,120 B2
Steel sheet for hot stamping
Takayuki Harano, Tokyo (JP); Yuji Sakiyama, Tokyo (JP); and Akinobu Kobayashi, Tokyo (JP)
Assigned to NIPPON STEEL CORPORATION, Tokyo (JP)
Appl. No. 17/802,569
Filed by NIPPON STEEL CORPORATION, Tokyo (JP)
PCT Filed May 13, 2021, PCT No. PCT/JP2021/018160
§ 371(c)(1), (2) Date Aug. 26, 2022,
PCT Pub. No. WO2021/230311, PCT Pub. Date Nov. 18, 2021.
Claims priority of application No. 2020-084585 (JP), filed on May 13, 2020.
Prior Publication US 2023/0093517 A1, Mar. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 15/01 (2006.01); B21D 22/02 (2006.01); C22C 21/02 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); C22C 38/08 (2006.01); C22C 38/14 (2006.01); C22C 38/16 (2006.01); C22C 38/26 (2006.01); C22C 38/32 (2006.01); C22C 38/38 (2006.01); C23C 2/26 (2006.01)
CPC B32B 15/012 (2013.01) [B21D 22/022 (2013.01); B32B 15/015 (2013.01); C22C 21/02 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/005 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/08 (2013.01); C22C 38/14 (2013.01); C22C 38/16 (2013.01); C22C 38/26 (2013.01); C22C 38/32 (2013.01); C22C 38/38 (2013.01); C23C 2/26 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A steel sheet for hot stamping comprising:
in this order,
a base material;
an Al—Si alloy plating layer in which an Al content is 75 mass % or more, a Si content is 3 mass % or more and a total of the Al content and the Si content is 95 mass % or more; and
a Ni plating layer having a Ni content of more than 92 mass %;
wherein the base material has a chemical composition of, by mass %:
C: 0.01% or more and less than 0.70%;
Si: 0.005% to 1.000%;
Mn: 0.40% to 3.00%;
Nb: 0.010% to 0.200%;
a solid solution of Nb: 0.010% to 0.150%;
sol. Al: 0.00020% to 0.50000%;
P: 0.100% or less;
S: 0.1000% or less;
N: 0.0100% or less;
Cu: 0% to 1.00%;
Ni: 0% to 1.00%;
V: 0% to 1.00%;
Ti: 0% to 0.150%;
Mo: 0% to 1.000%;
Cr: 0% to 1.000%;
B: 0% to 0.0100%;
Ca: 0% to 0.010%;
REM: 0% to 0.300%; and
a remainder: Fe and an impurity,
the Al—Si alloy plating layer has a thickness of 7 to 148 μm, and
the Ni plating layer has a thickness of more than 200 nm and 2500 nm or less.