US 11,917,922 B2
Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, and electronic apparatus
Koji Ohashi, Matsumoto (JP); Chikara Kojima, Matsumoto (JP); Hiroshi Matsuda, Chino (JP); Hironori Suzuki, Chino (JP); and Shuichi Tanaka, Chino (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Jan. 9, 2023, as Appl. No. 18/151,640.
Application 18/151,640 is a continuation of application No. 16/097,011, granted, now 11,581,478, previously published as PCT/JP2017/015920, filed on Apr. 20, 2017.
Claims priority of application No. 2016-089569 (JP), filed on Apr. 27, 2016; and application No. 2016-184369 (JP), filed on Sep. 21, 2016.
Prior Publication US 2023/0165154 A1, May 25, 2023
Int. Cl. H01L 41/047 (2006.01); B06B 1/06 (2006.01); H10N 30/87 (2023.01); H10N 30/88 (2023.01); A61B 8/00 (2006.01); H10N 39/00 (2023.01)
CPC H10N 30/88 (2023.02) [B06B 1/0622 (2013.01); B06B 1/0629 (2013.01); H10N 30/87 (2023.02); H10N 30/875 (2023.02); A61B 8/4444 (2013.01); A61B 8/4477 (2013.01); A61B 8/4494 (2013.01); H10N 39/00 (2023.02)] 3 Claims
OG exemplary drawing
 
1. A mounting structure comprising:
a first substrate and a second substrate;
a wiring portion provided on the first substrate;
a conductive portion provided on the second substrate and connected to the wiring portion by contacting the wiring portion; and
a functional element between the first substrate and the second substrate;
wherein the functional element has a first portion and a second portion arranged in a first direction connected by an electrically conductive connection line that extends along the first direction,
wherein the conductive portion is disposed between the first portion of the functional element and the second portion of the functional element in the first direction, and
wherein the wiring portion electrically contacts the electrically conductive connection line.