US 11,917,794 B2
Separating temperature domains in cooled systems
Andrew G. Kegel, Bellevue, WA (US); and Jeffrey Bialozor, Bellevue, WA (US)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed on Oct. 30, 2020, as Appl. No. 17/085,324.
Prior Publication US 2022/0142003 A1, May 5, 2022
Int. Cl. H05K 7/20 (2006.01); H01L 23/44 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/20372 (2013.01) [H01L 23/445 (2013.01); H05K 1/0203 (2013.01); H05K 1/0207 (2013.01); H05K 7/205 (2013.01)] 27 Claims
OG exemplary drawing
 
1. A method for separating temperature domains in cooled systems, the method comprising:
cooling at least one first component of a circuit board and a superconductive portion of a power plane of the circuit board using a first cooling system, wherein the first cooling system is configured to provide cooling meeting or falling below a superconductivity threshold associated with the superconductive portion of the power plane of the circuit board; and
conductively coupling the at least one first component to at least one second component of the circuit board using the superconductive portion of the power plane of the circuit board, wherein the superconductive portion of the power plane is a high temperature cuprate superconductor, wherein conductively coupling the at least one first component to the at least one second component comprises bridging, using an interconnecting bridge, the superconductive portion of the power plane to a non-superconductive portion of the power plane, the non-superconductive portion coupled to the at least one second component.