CPC H05K 7/20163 (2013.01) [H02K 5/207 (2021.01); H02K 9/06 (2013.01); H02K 9/227 (2021.01); H05K 7/20863 (2013.01); H02K 11/33 (2016.01)] | 9 Claims |
1. A heat-dissipating device, comprising:
a support; and
a heat sink configured to be cooled by a flow of air passing through the heat sink,
wherein the support comprises a first housing space inside which the heat sink is held;
wherein the support is configured to accommodate an electronic control module configured to be cooled by the heat sink;
wherein the first housing space is configured to guide the flow of air through the heat sink between a slot situated in an end wall of the first housing space and an opening situated on a lateral side of the first housing space;
wherein the support has a cylindrical form such that the end wall forms the curved surface of the support and the slot situated in the end wall of the first housing space is an arcuate cutout of the curved surface of the support.
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