US 11,917,755 B2
Carrier-foil-attached ultra-thin copper foil
Won Jin Beom, Jeollabuk-do (KR); Sun Hyung Lee, Jeollabuk-do (KR); Eun Sil Choi, Jeollabuk-do (KR); Ki Deok Song, Jeollabuk-do (KR); and Hyung Cheol Kim, Jeollabuk-do (KR)
Assigned to Lotte Energy Materials Corporation, Jeollabuk-Do (KR)
Appl. No. 16/477,653
Filed by Iljin Materials Co., Ltd., Jeollabuk-do (KR)
PCT Filed Jan. 15, 2018, PCT No. PCT/KR2018/000667
§ 371(c)(1), (2) Date Sep. 10, 2019,
PCT Pub. No. WO2018/131961, PCT Pub. Date Jul. 19, 2018.
Claims priority of application No. 10-2017-0007043 (KR), filed on Jan. 16, 2017.
Prior Publication US 2023/0189439 A1, Jun. 15, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/09 (2006.01)
CPC H05K 1/09 (2013.01) [H05K 2201/0338 (2013.01); H05K 2201/0355 (2013.01); Y10T 428/12431 (2015.01)] 12 Claims
OG exemplary drawing
 
1. A carrier foil-attached ultra-thin copper foil comprising:
a carrier foil;
a release layer;
a first ultra-thin copper foil;
a copper (Cu)-aluminum (Al) bonding strength improvement layer;
an Al layer; and
a second ultra-thin copper foil,
wherein the release layer includes a first metal (A3) having a peeling property and second and third metals (B3, C3) which facilitate plating of the first metal (A3);
wherein the carrier foil-attached ultra-thin copper foil is formed by sequentially stacking the carrier foil, the release layer, the first ultra-thin copper foil, the Cu—Al bonding strength improvement layer, the Al layer, and the second ultra-thin copper foil; and
wherein the copper (Cu)-aluminum (Al) bonding strength improvement layer is a layer which improves bonding strength between the Al layer and the first ultra-thin copper foil.